Signal and Power Integrity For High Speed Electronic Circuits
Electrical Engineering
Institute of Natural and Applied Sciences
Third Cycle (Doctorate Degree)
| Course Unit Title | Course Unit Code | Type of Course Unit | Level of Course Unit | Year of Study | Semester | ECTS Credits |
|---|---|---|---|---|---|---|
| Signal and Power Integrity For High Speed Electronic Circuits | MEL612 | Elective | Doctorate degree | 1 | Spring | 8 |
Name of Lecturer(s)
Associate Prof. Dr. Ersoy KELEBEKLER
Learning Outcomes of the Course Unit
1) Learning the concepts of signal integrity, power delivery and electromagnetic
2) Performing PCB design using software.
3) Importing the designed PCB with software to electromagnetic analysis program
4) Modeling and simulating the designed PCB in electromagnetic analysis program
Program Competencies-Learning Outcomes Relation
| Program Competencies | |||||||||||
| 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | ||
| Learning Outcomes | |||||||||||
| 1 | High | Middle | High | High | High | Low | Low | Low | Low | Low | |
| 2 | High | Low | Middle | High | Low | Low | High | High | Low | High | |
| 3 | Middle | Low | Low | High | Low | Low | High | High | No relation | Middle | |
| 4 | Middle | Low | Low | High | Low | Low | High | High | No relation | Middle | |
Mode of Delivery
Face to Face
Prerequisites and Co-Requisites
None
Recommended Optional Programme Components
MEL529 Electromagnetic Compatibility In Power Electronics Systems
Course Contents
Signal and power integrity in high speed electronic circuits, transmission lines; reflection, loss, coupling, interference, cross talk, jitter, electromagnetic interference (EMI), electromagnetic compatibility (EMC), time and frequency domain, bandwidth and rise time, impedance and electrical models, transmission lines, calculating characteristic impedance of transmission line, transmission lines and reflection, losses in transmission lines, lossy lines, rise time degradation and material properties, cross talk in transmission lines, S-parameters for signal integrity applications, power delivery and power distribution network (PND) in PCB design, Printed Circuit Board (PCB) technologies, trace thickness and via structure for maximum current, physical layers in PCB, PCB design software and tools, Importing the PCB designed with software to electromagnetic analysis software, modeling and simulation of the PCB with electromagnetic analysis software, example applications
Weekly Schedule
1) Fundamental concepts; signal/power integrity in high speed electronic circuits, transmission lines; reflection, loss, coupling, interference, cross talk, jitter, electromagnetic interference (EMI), electromagnetic compatibility (EMC),2) Time and frequency domain, bandwidth and rise time; bandwidth of real signal, bandwidth and clock frequency, bandwidth of a measurement, bandwidth of a model, and bandwidth of an interconnect
3) Impedance and electrical models, resistance; bulk resistivity, resistance per length, sheet resistance, capacitance; dielectric constant, power and ground planes and decoupling capacitance, capacitance per length, inductance; self inductance, mutual inductance and partial inductance, loop inductance, current distribution and skin depth, high-permeability materials, eddy currents
4) Transmission lines; speed of a signal in a transmission line, the impedance of transmission line, calculating characteristic impedance of transmission line, transmission lines and reflection; reflections from short serial transmission lines, reflections from short-stub transmission lines, reflections from capacitive end terminations, reflections from capacitive loads in the middle of a trace
5) Losses in transmission lines, lossy lines, rise time degradation and material properties, signal velocity in a lossy transmission line, attenuation in a lossy transmission line, time domain behavior of lossy transmission lines, eye diagram
6) Cross talk in transmission lines, capacitively coupled currents, inductively coupled currents, near-field and far-field cross talk
7) Midterm Exam
8) S-parameters for signal integrity applications
9) Power delivery and power distribution network (PND) in PCB design, power distribution and impedance, capacitance and inductance in terms of power distribution, measurement of PND switching noises
10) Printed Circuit Board (PCB) technologies, trace thickness and via structure for maximum current, physical layers in PCB, layer connections/via technologies, thermal and thermal relief vias, the resistance of a via, the resistance of a thermal via
11) PCB design software and tools
12) Impedance calculating and impedance matching tools for PCB designed with software
13) Importing the PCB designed with software to electromagnetic analysis software, modeling and simulation of the PCB with electromagnetic analysis software
14) Example applications with Signal and power integrity 1
15) Example applications with Signal and power integrity 2
16) Final Exam
Recommended or Required Reading
1- Eric Bogatin, Signal and Power Integrity - Simplified, 3rd Edition, Prentice Hall, 2018
2- Eric Bogatin, Bogatin's Practical Guide to Prototype Breadboard and PCB Design, Artech House, 2021
3- Xing-Chang Wei, Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Taylor&Francis, 2017
4- Fabie Ndagijimana, Signal integrity from high speed to radio frequency application, Wiley, 2014
5- Ralph Morrison, Fast circuit boards, Energy management, Wiley, 2018
6- Mike Peng Li, Jitter, Noise, and Signal Integrity at High-Speed, Printice Hall, 2008
7- Raj Nair, Donald Bennett ,Power Integrity Analysis and Management for Integrated Circuits, Prentice Hall, 2010
Planned Learning Activities and Teaching Methods
1) Lecture
2) Question-Answer
3) Discussion
4) Drill and Practice
5) Modelling
6) Simulation
7) Case Study
8) Self Study
9) Project Based Learning
Assessment Methods and Criteria
Contribution of Midterm Examination to Course Grade |
50% |
|---|---|
Contribution of Final Examination to Course Grade |
50% |
Total |
100% |
Language of Instruction
Turkish
Work Placement(s)
Not Required